The turn of the 21st century unlocked a new era in the microelectronics industry, characterized by increasing performance expectations and stricter global manufacturing standards. Customer demands rapidly evolved, highlighting the need for improved adhesive resins for packaging applications and advanced technology for higher-frequency applications. As businesses strived to keep up, Designer Molecules, Inc. (DMI) developed superior organic solutions that shaped the next generation of advanced microelectronic materials.
A global developer of reactive monomers and functional oligomers, DMI solves complex processing and performance challenges for advanced materials through novel reactive chemistries. Its products are predominantly used in microelectronics to support wafer fabrication, packaging and printed circuit board applications.
“Our products consistently outperform commercially available alternatives because we rely on our sales team to collect customer feedback and integrate their insights into our development process from the start,” says Frank D. Husson, Jr., president and CEO.
DMI’s product innovations are centered on reactive chemistries that offer thermal stability and low moisture uptake—critical attributes for high-reliability electronics. Over the years, the company has focused on numerous key development areas and curated a library of compounds. The synthesis of imide-extended bismaleimide (BMI) oligomers with aromatic, aliphatic and cycloaliphatic backbones is one of its many breakthroughs. These thermoset materials outperform conventional epoxy resins, particularly in high-temperature lead-free solder reflow conditions of up to 260°C. Their inherent hydrophobicity helps adhere to stringent moisture resistance benchmarks. BMI-based materials also exhibit low dissipation factors (Df values ≤0.003), essential for enabling high-frequency applications like 5G communications, radar systems and automotive sensors.
Its acrylate-and methacrylate-terminated oligomeric polyesters also meet the requirement for thermal stability at 260°C solder reflow. These polyesters are suited for use as temporary adhesives in silicon wafer back-side grinding. In addition, the colorless variants of its methacrylate-terminated oligomers have shown significant promise in dental composites and orthodontic applications.
DMI’s chemical acumen is best highlighted in the development of a military-grade conductive adhesive. The application required an electrical conductivity level that traditional silver-filled die-attach adhesives couldn’t provide. Its in-house chemists developed a solution using soluble palladium itaconate (SPdl), a novel palladium-containing molecule that decomposes at 160°C during cure.
Upon decomposition, SPdl releases discrete palladium atoms or atom clusters into the resin matrix. The palladium particles bridge the gaps between silver flakes, drastically improving electron flow and boosting conductivity by a factor of 200. This approach met the stringent conductivity requirements and maintained the mechanical and thermal stability necessary for high-reliability defense systems. The innovation is protected under U.S. patent #US8,398,898 and has been in use for over a decade.
DMI’s innovations are powered by a production facility built in the 1970s to dissolve and precipitate precious metal powders for multilayer capacitors. The site is equipped with glass-lined reactors, vacuum mixers, three-roll mills and a wide range of analytical instrumentation. While DMI’s capabilities are currently best suited for liquid or solvent-based resins, the infrastructure supports high-complexity, low-volume production, which is ideal for specialty applications that require molecular precision over a mass scale.
In recent years, wafer fabrication and packaging customers have become increasingly risk-averse and prefer suppliers with global manufacturing footprints. The pandemic amplified this requirement, exposing vulnerabilities in geographically limited supply chains. To keep up with this growing demand, DMI is actively exploring partnerships and acquisition opportunities with larger chemical companies. It aims to scale production, enhance supply chain resilience and better align with clients’ global sourcing policies.
In a space where material performance is directly tied to end-product success, DMI stands out as a specialty partner with an extensive portfolio and chemical know-how. With the demand for at-scale production of specialized chemistries at an all-time high, the company’s next chapter will be defined by strategic collaboration, ensuring its products continue to reach critical industries.
A global developer of reactive monomers and functional oligomers, DMI solves complex processing and performance challenges for advanced materials through novel reactive chemistries. Its products are predominantly used in microelectronics to support wafer fabrication, packaging and printed circuit board applications.
“Our products consistently outperform commercially available alternatives because we rely on our sales team to collect customer feedback and integrate their insights into our development process from the start,” says Frank D. Husson, Jr., president and CEO.
DMI’s product innovations are centered on reactive chemistries that offer thermal stability and low moisture uptake—critical attributes for high-reliability electronics. Over the years, the company has focused on numerous key development areas and curated a library of compounds. The synthesis of imide-extended bismaleimide (BMI) oligomers with aromatic, aliphatic and cycloaliphatic backbones is one of its many breakthroughs. These thermoset materials outperform conventional epoxy resins, particularly in high-temperature lead-free solder reflow conditions of up to 260°C. Their inherent hydrophobicity helps adhere to stringent moisture resistance benchmarks. BMI-based materials also exhibit low dissipation factors (Df values ≤0.003), essential for enabling high-frequency applications like 5G communications, radar systems and automotive sensors.
Its acrylate-and methacrylate-terminated oligomeric polyesters also meet the requirement for thermal stability at 260°C solder reflow. These polyesters are suited for use as temporary adhesives in silicon wafer back-side grinding. In addition, the colorless variants of its methacrylate-terminated oligomers have shown significant promise in dental composites and orthodontic applications.
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Our products consistently outperform commercially available alternatives because we rely on our sales team to collect customer feedback and integrate their insights into our development process from the start
DMI’s chemical acumen is best highlighted in the development of a military-grade conductive adhesive. The application required an electrical conductivity level that traditional silver-filled die-attach adhesives couldn’t provide. Its in-house chemists developed a solution using soluble palladium itaconate (SPdl), a novel palladium-containing molecule that decomposes at 160°C during cure.
Upon decomposition, SPdl releases discrete palladium atoms or atom clusters into the resin matrix. The palladium particles bridge the gaps between silver flakes, drastically improving electron flow and boosting conductivity by a factor of 200. This approach met the stringent conductivity requirements and maintained the mechanical and thermal stability necessary for high-reliability defense systems. The innovation is protected under U.S. patent #US8,398,898 and has been in use for over a decade.
DMI’s innovations are powered by a production facility built in the 1970s to dissolve and precipitate precious metal powders for multilayer capacitors. The site is equipped with glass-lined reactors, vacuum mixers, three-roll mills and a wide range of analytical instrumentation. While DMI’s capabilities are currently best suited for liquid or solvent-based resins, the infrastructure supports high-complexity, low-volume production, which is ideal for specialty applications that require molecular precision over a mass scale.
In recent years, wafer fabrication and packaging customers have become increasingly risk-averse and prefer suppliers with global manufacturing footprints. The pandemic amplified this requirement, exposing vulnerabilities in geographically limited supply chains. To keep up with this growing demand, DMI is actively exploring partnerships and acquisition opportunities with larger chemical companies. It aims to scale production, enhance supply chain resilience and better align with clients’ global sourcing policies.
In a space where material performance is directly tied to end-product success, DMI stands out as a specialty partner with an extensive portfolio and chemical know-how. With the demand for at-scale production of specialized chemistries at an all-time high, the company’s next chapter will be defined by strategic collaboration, ensuring its products continue to reach critical industries.
Company : Designer Molecules Inc.
Headquarters :
. ManagementFrank D. Husson, Jr., President and CEO
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